Kemet Double Sided Lapping Polishing Machines
Kemet Dual Face Machines are advanced solutions designed for grinding, lapping, and polishing both flat surfaces of components simultaneously. These machines are capable of handling a wide variety of materials, ensuring high precision and consistency in processing. With the ability to achieve extremely tight tolerances, they are especially effective for working with delicate or fragile parts. The smooth operation of the grinding or lapping process is ensured by driving five carriers, which maintain stable action throughout.
The machines are equipped with variable plate and carrier speeds, controlled through an AC frequency drive, allowing for optimal adjustment based on specific needs. Additionally, Kemet provides custom plates tailored for fine grinding, standard grinding, or lapping, ensuring peak performance for each application.
Several optional features enhance the functionality of Kemet Dual Face Machines, including Automatic Thickness Control, Load Cell Pressure Control for precise force management, and an intuitive HMI Touch Panel for easy operation and monitoring.
These machines are ideal for a range of high-precision applications, such as processing sapphire and silicon wafers, precision optics, filter glass, sapphire watch glass, quartz crystals, and components for disk drives. Kemet also offers a comprehensive range of lapping and polishing systems to meet various industrial needs. For specialised requirements, Kemet can develop custom machines tailored to specific applications, providing versatile and reliable solutions for precise material finishing.
Kemet DS 6, 9, 12 Series With Analogue Control
Specification | DS 6 | DS 9 | DS 12 |
---|---|---|---|
Diameter of Lapping Plate (mm) | Dia. 374 x Dia. 150mm | Dia. 645 x Dia. 235mm | Dia. 753 x Dia. 260mm |
Maximum Diameter of Products (mm) | Dia. 110mm | Dia. 180mm | Dia. 220mm |
Diameter of Carrier (PCD)(mm) | Dia. 139.3 (PCD) | Dia. 228.5 (PCD) | Dia. 283.6 (PCD) |
Number of Carrier | 5 Pcs | 5 Pcs | 5 Pcs |
Minimum Thickness of Products (mm) | 0.08mm | 0.3mm | 0.3mm |
Rotating Speed of Lower Lapping Plate (RPM) | 0 - 60 RPM | 0 - 60 RPM | 0 - 60 RPM |
Reversal mechanism of Carrier | CW & CCW | CW & CCW | CW & CCW |
Size (mm) | 930 (W) X 700 (L) X 1930 (H) | 1740 (W) X 1070 (L) X 2090 (H) | 1610 (W) X 1200 (L) X 2400 (H) |
Estimated Weight | 800 KGS | 1800 KGS | 2300 KGS |
Electric Supply | 380V / 415V 3Ph 50Hz | 380V / 415V 3Ph 50Hz | 380V / 415V 3Ph 50Hz |
Kemet DS 6, 9, 12 Series With HMI Control
Specification | DS 6 | DS 9 | DS 12 |
---|---|---|---|
Diameter of Lapping Plate | Dia. 374 x Dia. 150 mm | Dia. 630 x Dia. 240 mm | Dia. 753 x 260 mm |
Maximum Diameter of Products | Dia. 110 mm | Dia. 180 mm | Dia. 220 mm |
Diameter of Carrier (PCD) | Dia. 139.3 (PCD) | Dia. 228.5 (PCD) | Dia. 283.6 (PCD) |
Number of Carrier | 5 Pcs | 5 Pcs | 5 Pcs |
Minimum Thickness of Products | 0.08mm | 0.3mm | 0.3mm |
Rotating Lapping Speed of Lower Plate (RPM) | 0 - 60 RPM | 0 - 60 RPM | 0 - 60 RPM |
Reversal Mechanism of Carrier | CW & CCW | CW & CCW | CW & CCW |
Machine Dimension [mm] | 930 (W) X 700 (L) X 1930 (H) | 1480 (W) X 880 (L) X 2400 (H) | 1610 (W)X 1200 (L)X 2400 (H) |
Estimated Weight | 800 kgs | 1800 kgs | 2300 kgs |
Electric Supply | 380V / 415V 3Ph 50Hz | 380V / 415V 3Ph 50Hz | 380V / 415V 3Ph 50Hz |
Kemet DS 16, 18 Series with HMI Control
Specification | DS 16 | DS 18 |
---|---|---|
Diameter of Lapping Plate | Dia. 1155 x ID 360 mm | Dia. 1262 x ID 535 mm |
Maximum Diameter of Products | Dia. 390 mm | Dia. 390 mm |
Diameter of Carrier (PCD) | Dia. 423.33 (PCD) mm | Dia. 423.33 (PCD) mm |
Number of Carrier | 5 Pcs | 6 Pcs |
Minimum Thickness of Products | 0.3 mm | 0.3 mm |
Rotating Speed of Lower Lapping Plate (RPM) | 0 - 60 RPM | 0 - 60 RPM |
Reversal Mechanism of Carrier | CW & CCW | CW & CCW |
Machine Dimension [mm] | 2020 (W) x 1500 (L) x 2260 (H) | 2530 (W) x 1900 (L) x 2260 (H) |
Estimated Weight | 6500 kgs | 7000 kgs |
Electric Supply | 380V / 415V 3Ph 50Hz | 380V / 415V 3Ph 50Hz |