Dual Face and Double Sided Lapping Polishing Machines

Kemet Dual Face Machines provide an advanced solution for simultaneously grinding, lapping, and polishing both flat surfaces of precision components. These machines are designed to process a diverse range of materials while maintaining high accuracy and consistency. Their capability to achieve extremely tight tolerances makes them particularly suitable for working with delicate and fragile components, ensuring minimal damage and superior results.

The precision of the grinding and lapping process is maintained by a system of five driven carriers, ensuring uniform and stable action throughout the operation. The machines feature variable plate and carrier speeds, which are controlled via an AC frequency drive, allowing operators to fine-tune settings for optimal performance based on specific processing needs.

To further enhance functionality, Kemet Dual Face Machines offer a range of optional features, including:

• Automatic Thickness Control for precise material removal and dimensional accuracy
• Load Cell Pressure Control to ensure consistent force distribution during processing
• HMI Touch Panel Interface for intuitive operation, real-time monitoring, and enhanced process control

These machines are ideal for high-precision applications across various industries, including semiconductor manufacturing, optics, and advanced materials. They are extensively used for processing sapphire and silicon wafers, optical components, filter glass, sapphire watch crystals, quartz elements, and disk drive components.

Kemet also offers a comprehensive selection of lapping and polishing systems tailored to different industrial requirements. For specialized applications, Kemet can design and manufacture custom machines to meet unique processing challenges, providing highly reliable and versatile solutions for precision material finishing.